IDC ABN — Materials for AI & Engineering Electronics

Adaptive & intelligent materials

Property‑tunable compositions (thermal/electrical conductivity, optical response) under temperature, pressure, or radiation.

Smart coatings, thermochromic and piezo‑active films.
Use cases: sensor skins, adjustable interfaces, adaptive surface coatings.

Materials for thermal & electrical management in AI modules

High‑thermal and electrically conductive composites based on nitrides, graphene, and nanocarbon fillers.

Tailored solutions for heat spreading, thermal interface materials, and electrical isolation across boards, processors, storage, and power stages.
Domains: edge computing, UAVs, autonomous platforms, compact server modules.

Sensors & wearable solutions

Ultra‑thin flexible materials for compact sensors (temperature, pressure, humidity, radiation).

Conductive elastomers and films for wearable and robotic systems.
Use cases: smart wearables, tactile surfaces, real‑time environmental monitoring.

Engineering materials for layout & protection

EMI/EMC shielding and absorbing materials.

Rugged housings and barrier materials resistant to mechanical and climatic loads.
Stability: high‑frequency operation, temperature cycling, vibration.

Custom formulations to device architecture

Formulations engineered to weight, thermal path, signal integrity, and EMC constraints.

Integration with electronics design and support for validation at sub‑assembly level.
Scale: from laboratory batches (grams) to pilot lots (tens of kilograms).

What you receive

Material/formulation with a property datasheet and specification.
Test protocols and reports (on request: thermal/electrical conductivity, sheet resistance, adhesion, high‑frequency stability, thermal cycling, humidity, salt‑fog).
Integration guidance: target thickness, deposition/assembly method, compatible primers/substrates.